(Custom PCBs are tailored products; the images and specifications provided are for reference only.)
Introduction to RO4350B
Rogers RO4350B is a proprietary woven glass reinforced hydrocarbon/ceramic material that offers electrical performance comparable to PTFE combined with the manufacturability of epoxy/glass. This material is designed for high-frequency applications, providing low dielectric loss and tight control over dielectric constant (Dk). Unlike traditional microwave laminates, RO4350B does not require special handling or treatments for through-holes, making it a cost-effective solution for RF designs.
Key Features of RO4350B
Dielectric Constant (Dk): 3.48 ± 0.05 at 10 GHz/23°C
Dissipation Factor: 0.0037 at 10 GHz/23°C
Thermal Conductivity: 0.69 W/m·K
CTE: X-axis: 10 ppm/°C, Y-axis: 12 ppm/°C, Z-axis: 32 ppm/°C
Tg: >280°C
Low Water Absorption: 0.06%
PCB Construction Details
Parameter | Details |
---|---|
Base Material | RO4350B |
Layer Count | 4 layers |
Board Dimensions | Outline 1: 70 mm x 50 mm (1 PCS, ± 0.15 mm) |
Outline 2: 70 mm x 40 mm | |
Minimum Trace/Space | 4/7 mils |
Minimum Hole Size | 0.3 mm |
Stepped Outline | Yes |
Finished Board Thickness | 0.5 mm |
Finished Copper Weight | 1 oz (1.4 mils) for outer layers |
Via Plating Thickness | 20 µm |
Blind and Buried Vias | L1-L2, L1-L3, L2-L3 |
Surface Finish | Immersion Gold |
Top Silkscreen | No |
Bottom Silkscreen | No |
Top Solder Mask | No |
Bottom Solder Mask | No |
Electrical Testing | 100% before shipment |
PCB Stackup
Layer | Details |
---|---|
Copper Layer 1 | 35 µm |
Rogers RO4350B Core | 0.762 mm (30 mil) |
Copper Layer 2 | 35 µm |
Prepreg (RO4450F) | 0.102 mm (4 mil) |
Copper Layer 3 | 35 µm |
Rogers RO4350B Core | 0.762 mm (30 mil) |
Copper Layer 4 | 35 µm |
PCB Statistics
Components: 9
Total Pads: 32B
Thru Hole Pads: 17
Top SMT Pads: 15
Bottom SMT Pads: 0
Vias: 23
Nets: 4
Artwork and Standards
Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
Benefits of RO4350B
Ideal for multi-layer board (MLB) constructions
Compatible with FR-4 processing at lower fabrication costs
Excellent dimensional stability
Competitively priced
Applications
Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
LNBs for Direct Broadcast Satellites